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Title Electrothermal Analysis of VLSI Systems
Author Yi-Kan Cheng
Publisher Springer Science & Business Media
Release 2007-05-08
Category Technology & Engineering
Total Pages 210
ISBN 0306470241
Language English, Spanish, and French
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Book Summary:

This useful book addresses electrothermal problems in modern VLSI systems. It discusses electrothermal phenomena and the fundamental building blocks that electrothermal simulation requires. The authors present three important applications of VLSI electrothermal analysis: temperature-dependent electromigration diagnosis, cell-level thermal placement, and temperature-driven power and timing analysis.

Title Thermal and Electro thermal System Simulation 2020
Author Márta Rencz
Publisher MDPI
Release 2021-01-12
Category Technology & Engineering
Total Pages 310
ISBN 303943831X
Language English, Spanish, and French
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Book Summary:

This book, edited by Prof. Marta Rencz and Prof Andras Poppe, Budapest University of Technology and Economics, and by Prof. Lorenzo Codecasa, Politecnico di Milano, collects fourteen papers carefully selected for the “thermal and electro-thermal system simulation” Special Issue of Energies. These contributions present the latest results in a currently very “hot” topic in electronics: the thermal and electro-thermal simulation of electronic components and systems. Several papers here proposed have turned out to be extended versions of papers presented at THERMINIC 2019, which was one of the 2019 stages of choice for presenting outstanding contributions on thermal and electro-thermal simulation of electronic systems. The papers proposed to the thermal community in this book deal with modeling and simulation of state-of-the-art applications which are highly critical from the thermal point of view, and around which there is great research activity in both industry and academia. In particular, contributions are proposed on the multi-physics simulation of families of electronic packages, multi-physics advanced modeling in power electronics, multiphysics modeling and simulation of LEDs, batteries and other micro and nano-structures.

Title Analytical Methodology of Tree Microstrip Interconnects Modelling For Signal Distribution
Author Blaise Ravelo
Publisher Springer Nature
Release 2019-11-21
Category Technology & Engineering
Total Pages 233
ISBN 9811505527
Language English, Spanish, and French
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Book Summary:

This book focuses on the modelling methodology of microstrip interconnects, discussing various structures of single-input multiple-output (SIMO) tree interconnects for signal integrity (SI) engineering. Further, it describes lumped and distributed transmission line elements based on single-input single-output (SIMO) models of symmetric and asymmetric trees, and investigates more complicated phenomenon, such as interbranch coupling. The modelling approaches are based on the analytical methods using the Z-, Y- and T-matrices. The established method enables the S-parameters and voltage transfer function of SIMO tree to be determined. Providing illustrative results with frequency and time domain analyses for each tree interconnect structure, the book is a valuable resource for researchers, engineers, and graduate students in fields of analogue, RF/microwave, digital and mixed circuit design, SI and manufacturing engineering.

Title Principles of Thermal Analysis and Calorimetry
Author Peter Haines
Publisher Royal Society of Chemistry
Release 2007-10-31
Category Science
Total Pages 234
ISBN 1847551769
Language English, Spanish, and French
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Book Summary:

The use of thermal and calorimetric methods has shown rapid growth over the last two decades, in an increasingly wide range of applications. In addition, a number of powerful new techniques have been developed. This book supplies a concise and readable account of the principles, experimental apparatus and practical procedures used in thermal analysis and calorimetric methods of analysis. Brief accounts of the basic theory are reinforced with detailed applications of the methods and contemporary developments. Also included is information on standard test methods and manufacturers. Written by acknowledged experts, Principles of Thermal Analysis and Calorimetry is up-to-date, wide-ranging and practical. It will be an important source of information for many levels of readership in a variety of areas, from students and lecturers through to industrial and laboratory staff and consultants.

Title Reliability Prediction from Burn In Data Fit to Reliability Models
Author Joseph Bernstein
Publisher Academic Press
Release 2014-03-06
Category Technology & Engineering
Total Pages 108
ISBN 0128008199
Language English, Spanish, and French
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Book Summary:

This work will educate chip and system designers on a method for accurately predicting circuit and system reliability in order to estimate failures that will occur in the field as a function of operating conditions at the chip level. This book will combine the knowledge taught in many reliability publications and illustrate how to use the knowledge presented by the semiconductor manufacturing companies in combination with the HTOL end-of-life testing that is currently performed by the chip suppliers as part of their standard qualification procedure and make accurate reliability predictions. This book will allow chip designers to predict FIT and DPPM values as a function of operating conditions and chip temperature so that users ultimately will have control of reliability in their design so the reliability and performance will be considered concurrently with their design. The ability to include reliability calculations and test results in their product design The ability to use reliability data provided to them by their suppliers to make meaningful reliability predictions Have accurate failure rate calculations for calculating warrantee period replacement costs

Title Thermal Nanosystems and Nanomaterials
Author Sebastian Volz
Publisher Springer Science & Business Media
Release 2009-12-24
Category Science
Total Pages 588
ISBN 3642042589
Language English, Spanish, and French
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Book Summary:

Heat transfer laws for conduction, radiation and convection change when the dimensions of the systems in question shrink. The altered behaviours can be used efficiently in energy conversion, respectively bio- and high-performance materials to control microelectronic devices. To understand and model those thermal mechanisms, specific metrologies have to be established. This book provides an overview of actual devices and materials involving micro-nanoscale heat transfer mechanisms. These are clearly explained and exemplified by a large spectrum of relevant physical models, while the most advanced nanoscale thermal metrologies are presented.

Title APCCAS
Author
Publisher
Release 2000
Category Electronic apparatus and appliances
Total Pages
ISBN
Language English, Spanish, and French
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Book Summary:

Title Thermal Testing of Integrated Circuits
Author J. Altet
Publisher Springer Science & Business Media
Release 2013-03-09
Category Technology & Engineering
Total Pages 204
ISBN 1475736355
Language English, Spanish, and French
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Book Summary:

Temperature has been always considered as an appreciable magnitude to detect failures in electric systems. In this book, the authors present the feasibility of considering temperature as an observable for testing purposes, with full coverage of the state of the art.